906-31-1-12-2-B-0 -

Heatsink; Eliptical Pin with clip assembly; 31 x 11.6 mm

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制造商：: Wakefield Wakefield
制造商產(chǎn)品編號(hào)：: 906-31-1-12-2-B-0
倉庫庫存編號(hào)：: 70357137
技術(shù)數(shù)據(jù)表：: Datasheet

訂購熱線： 400-900-3095 0755-21000796, QQ:800152669, Email:sales@szcwdz.com

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906-31-1-12-2-B-0產(chǎn)品概述

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

906-31-1-12-2-B-0產(chǎn)品信息

906-31-1-12-2-B-0相關(guān)搜索

Brand/Series 906 Series Wakefield Brand/Series 906 Series Heatsinks Brand/Series 906 Series Wakefield Heatsinks Brand/Series 906 Series Dimensions 31 x 11.6 mm Wakefield Dimensions 31 x 11.6 mm Heatsinks Dimensions 31 x 11.6 mm Wakefield Heatsinks Dimensions 31 x 11.6 mm Finish Black Anodized Wakefield Finish Black Anodized Heatsinks Finish Black Anodized Wakefield Heatsinks Finish Black Anodized For Use With BGA Wakefield For Use With BGA Heatsinks For Use With BGA Wakefield Heatsinks For Use With BGA Material Aluminum Wakefield Material Aluminum Heatsinks Material Aluminum Wakefield Heatsinks Material Aluminum Thermal Resistance 3.5 °C/W Wakefield Thermal Resistance 3.5 °C/W Heatsinks Thermal Resistance 3.5 °C/W Wakefield Heatsinks Thermal Resistance 3.5 °C/W

Brand/Series	906 Series
Dimensions	31 x 11.6 mm
Finish	Black Anodized
For Use With	BGA
Material	Aluminum
Thermal Resistance	3.5 °C/W
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