647-10ABP - 

Application Board Level Power Semiconductors  Wakefield Application Board Level Power Semiconductors  Heatsinks Application Board Level Power Semiconductors  Wakefield Heatsinks Application Board Level Power Semiconductors   Brand/Series 647 Series  Wakefield Brand/Series 647 Series  Heatsinks Brand/Series 647 Series  Wakefield Heatsinks Brand/Series 647 Series   Color Black  Wakefield Color Black  Heatsinks Color Black  Wakefield Heatsinks Color Black   Configuration Vertical  Wakefield Configuration Vertical  Heatsinks Configuration Vertical  Wakefield Heatsinks Configuration Vertical   Convection, Forced 3.8°C/W @ 200 LFM  Wakefield Convection, Forced 3.8°C/W @ 200 LFM  Heatsinks Convection, Forced 3.8°C/W @ 200 LFM  Wakefield Heatsinks Convection, Forced 3.8°C/W @ 200 LFM   Convection, Natural 42°C @ 6 W  Wakefield Convection, Natural 42°C @ 6 W  Heatsinks Convection, Natural 42°C @ 6 W  Wakefield Heatsinks Convection, Natural 42°C @ 6 W   Dimensions 1.65 x 1 in.  Wakefield Dimensions 1.65 x 1 in.  Heatsinks Dimensions 1.65 x 1 in.  Wakefield Heatsinks Dimensions 1.65 x 1 in.   Finish Black Anodized  Wakefield Finish Black Anodized  Heatsinks Finish Black Anodized  Wakefield Heatsinks Finish Black Anodized   For Use With TO-220  Wakefield For Use With TO-220  Heatsinks For Use With TO-220  Wakefield Heatsinks For Use With TO-220   Height, Above PC Board 1 in.  Wakefield Height, Above PC Board 1 in.  Heatsinks Height, Above PC Board 1 in.  Wakefield Heatsinks Height, Above PC Board 1 in.   Material Aluminum  Wakefield Material Aluminum  Heatsinks Material Aluminum  Wakefield Heatsinks Material Aluminum   Mounting Style Vertical  Wakefield Mounting Style Vertical  Heatsinks Mounting Style Vertical  Wakefield Heatsinks Mounting Style Vertical   Package Type TO-220  Wakefield Package Type TO-220  Heatsinks Package Type TO-220  Wakefield Heatsinks Package Type TO-220   Primary Type TO-220  Wakefield Primary Type TO-220  Heatsinks Primary Type TO-220  Wakefield Heatsinks Primary Type TO-220   Resistance, Thermal 3.8 °C/W  Wakefield Resistance, Thermal 3.8 °C/W  Heatsinks Resistance, Thermal 3.8 °C/W  Wakefield Heatsinks Resistance, Thermal 3.8 °C/W   Special Features Wave-Solderable Pins in 1 in Centers for Vertical Mounting of Larger Devices on Printed Circuit Boards.  Wakefield Special Features Wave-Solderable Pins in 1 in Centers for Vertical Mounting of Larger Devices on Printed Circuit Boards.  Heatsinks Special Features Wave-Solderable Pins in 1 in Centers for Vertical Mounting of Larger Devices on Printed Circuit Boards.  Wakefield Heatsinks Special Features Wave-Solderable Pins in 1 in Centers for Vertical Mounting of Larger Devices on Printed Circuit Boards.   Thermal Resistance 3.8 °C/W  Wakefield Thermal Resistance 3.8 °C/W  Heatsinks Thermal Resistance 3.8 °C/W  Wakefield Heatsinks Thermal Resistance 3.8 °C/W   Type Board Level  Wakefield Type Board Level  Heatsinks Type Board Level  Wakefield Heatsinks Type Board Level   Weight 24.95 g  Wakefield Weight 24.95 g  Heatsinks Weight 24.95 g  Wakefield Heatsinks Weight 24.95 g