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624-25ABT4E - 

Heatsink; Omnidirectional; 21 mm; Double Tape

Wakefield 624-25ABT4E
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制造商產(chǎn)品編號：
624-25ABT4E
倉庫庫存編號：
70236700
技術數(shù)據(jù)表：
View 624-25ABT4E Datasheet Datasheet
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由于產(chǎn)品數(shù)據(jù)庫龐大，部分產(chǎn)品信息可能未能及時更新，下單前請與銷售人員確認好實時在庫數(shù)量，謝謝合作！

624-25ABT4E產(chǎn)品概述

The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS).

624-25ABT4E產(chǎn)品信息

  Application  Integrated Circuits  
  Brand/Series  624 Series  
  Color  Black  
  Configuration  Omnidirectional  
  Dimensions  0.827 Sq. in.  
  Finish  Black Anodized  
  For Use With  BGA  
  Height, Above PC Board  0.25 in.  
  Material  Aluminum  
  Mounting Style  Omnidirectional  
  Package Type  BGA  
  Primary Type  BGAs/Super BGAs/PBGAs/FPBGAs  
  Special Features  Omnidirectional Fin Pin  
  Thermal Resistance  25 °C/W  
  Type  Omnidirectional  
  Weight  4.09 g  
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624-25ABT4E相關搜索

Application Integrated Circuits  Wakefield Application Integrated Circuits  Heatsinks Application Integrated Circuits  Wakefield Heatsinks Application Integrated Circuits   Brand/Series 624 Series  Wakefield Brand/Series 624 Series  Heatsinks Brand/Series 624 Series  Wakefield Heatsinks Brand/Series 624 Series   Color Black  Wakefield Color Black  Heatsinks Color Black  Wakefield Heatsinks Color Black   Configuration Omnidirectional  Wakefield Configuration Omnidirectional  Heatsinks Configuration Omnidirectional  Wakefield Heatsinks Configuration Omnidirectional   Dimensions 0.827 Sq. in.  Wakefield Dimensions 0.827 Sq. in.  Heatsinks Dimensions 0.827 Sq. in.  Wakefield Heatsinks Dimensions 0.827 Sq. in.   Finish Black Anodized  Wakefield Finish Black Anodized  Heatsinks Finish Black Anodized  Wakefield Heatsinks Finish Black Anodized   For Use With BGA  Wakefield For Use With BGA  Heatsinks For Use With BGA  Wakefield Heatsinks For Use With BGA   Height, Above PC Board 0.25 in.  Wakefield Height, Above PC Board 0.25 in.  Heatsinks Height, Above PC Board 0.25 in.  Wakefield Heatsinks Height, Above PC Board 0.25 in.   Material Aluminum  Wakefield Material Aluminum  Heatsinks Material Aluminum  Wakefield Heatsinks Material Aluminum   Mounting Style Omnidirectional  Wakefield Mounting Style Omnidirectional  Heatsinks Mounting Style Omnidirectional  Wakefield Heatsinks Mounting Style Omnidirectional   Package Type BGA  Wakefield Package Type BGA  Heatsinks Package Type BGA  Wakefield Heatsinks Package Type BGA   Primary Type BGAs/Super BGAs/PBGAs/FPBGAs  Wakefield Primary Type BGAs/Super BGAs/PBGAs/FPBGAs  Heatsinks Primary Type BGAs/Super BGAs/PBGAs/FPBGAs  Wakefield Heatsinks Primary Type BGAs/Super BGAs/PBGAs/FPBGAs   Special Features Omnidirectional Fin Pin  Wakefield Special Features Omnidirectional Fin Pin  Heatsinks Special Features Omnidirectional Fin Pin  Wakefield Heatsinks Special Features Omnidirectional Fin Pin   Thermal Resistance 25 °C/W  Wakefield Thermal Resistance 25 °C/W  Heatsinks Thermal Resistance 25 °C/W  Wakefield Heatsinks Thermal Resistance 25 °C/W   Type Omnidirectional  Wakefield Type Omnidirectional  Heatsinks Type Omnidirectional  Wakefield Heatsinks Type Omnidirectional   Weight 4.09 g  Wakefield Weight 4.09 g  Heatsinks Weight 4.09 g  Wakefield Heatsinks Weight 4.09 g  
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