5177983-1產品概述
AMP 0.8 mm FH surface-mount connectors are designed for parallel board stacking applications using subminiature connectors to meet today's electronic industry requirements for high density packaging. It is possible to save more than 50% of the required board space when compared to conventional 1.27 centerline connectors. 0.8 mm FH connectors are ideally suited for application downsizing, such as notebook PCs, pen pads, cellular telephones and other electronic equipment requiring miniature connector packaging. Vertical board-mount plugs and receptacles are available. The receptacles are preloaded with AMP's unique bellows-type spring contacts for reliable electrical connection with the plugs. Surface-mount solder leads permit fast assembly operation.
Note: Stack Height = (Receptacle Height + Plug Height) – 5.
Features
For Parallel Board Stacking Applications
High-Density Packaging on 0.8 mm Centerline Spacing
Available Sizes from 40- to 200-Positions (in 20-Position Increments)
Board Stacking Heights Available from 5 to 16 mm (in Increments of 1 mm)
Bellows Type Spring Contacts Are Resistant to Scooping and Stubbing During Mating and Unmating
Positioning Bosses for Proper On-Board Orientation
Recognized Under the Component Program of Underwriter Laboratories Inc.
Specifications
Plating Thickness: 8 μ"
Voltage Rating: 100 VAC
Current Rating: 0.5 Amp
Contact Resistance: 30 Milliohms Max. (Initial)
Dielectric Withstanding Voltage: 500 VAC (1 Minute)
Operating Temperature: –40°C to +85°C
Datasheet
