10-729387-001產(chǎn)品概述
RADSERT™’s compact footprint design can deliver up to 120A of current to the board. The high current density and small surface area connection provides flexibility of board design. RADSERT™ contacts are available in either press-fit or solder termination.
High power to board interconnect in a small package
Hyperbolic socket design ensures many points of contact
Solder version or pre-loaded RADSERTs are installed during board fabrication
RADSERT™ 2.4mm (35A), 3.0mm (60A), 3.6mm (70A) 4.8mm (100A) & 6.0mm (120A)
No special crimp tools required
No threaded fasteners
Eliminates risk of PTH cracking or delamination in board
Faster through-put
Available in Super Twist (ST)
Datasheet
