10-700300-001產(chǎn)品概述
The RADSOK® PowerBlok™’s compact footprint 1⁄2" x 1⁄2" can supply up to 70A to backplane power connections. Current is distributed over 16 compliant pins. The PowerBlok™ is available for top or bottom entry and offered with a touchproof cover.
High power to board interconnect in a small package
Compact footprint 15.7mm x 15.7mm
RADSOK® 2.4mm, 3.0mm & 3.6mm (35A-60A-70A)
Backplane power interface with compliant pins for power
Touchproof cover
Hyperbolic socket design ensures many points of contact
Reduces failure modes, eliminates burn outs
No threaded fasteners
No special crimp tools required
Eliminates possible stress fractures in board
Faster through-put
Available in Super Twist (ST)